High Quality Aluminum Heat Sink 240 x 105 x 40mm

Description

Aluminum Heat Sink 240 x 105 x 40mm

Introducing the Aluminum Heat Sink 240 x 105 x 40mm, PHS105-200, the perfect solution for effective heat dissipation in various electronic applications. Designed with precision and durability in mind, this heat sink is engineered to efficiently dissipate heat and keep your devices running at optimal temperatures.

With its dimensions of 240x105x40mm, the PHS105-200 is suitable for a wide range of applications, including power amplifiers, LED lights, computer CPUs, and more. Its compact size allows for easy installation and integration into your existing systems.

High Power Extruded Heat sinks
Designed for high power semi-conductor and thermoelectric applications.
Compact size and Easy mountable
Machined thermal interface for excellent heat transfer.
Designed for industry standard fans assemble.
Brand New and High Quality.

The PHS105-200 features a high-quality aluminum construction, which ensures excellent thermal conductivity and corrosion resistance. This heat sink is capable of effectively transferring heat away from your electronic components, preventing overheating and prolonging their lifespan.

Equipped with a finned design, the heat sink maximizes the surface area for heat dissipation, enhancing its cooling performance. The fins are carefully spaced to optimize airflow and promote efficient heat transfer, ensuring that your devices remain cool even under heavy loads.

Installation is quick and hassle-free, thanks to the pre-drilled mounting holes. Simply attach the heat sink to your device using screws or thermal adhesive, and you’re ready to go.

Invest in the Aluminum Heat Sink 240x105x40mm, PHS105-200, and experience reliable heat dissipation for your electronic components. With its superior performance and durable construction, this heat sink is an excellent choice for professionals and enthusiasts alike

NOTED: Product Images are shown for illustrative purposes only and may differ from actual product.

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